1968 Monolithic Systems Technology MST 

Controlled Collapse Chip Connection, or C4 (C4) process.

Monolithic Systems Technology MST, introduced in 1968

The MST used the same basic packaging as the SLT chips. The chip was mounted upside down on a 1/2 square ceramic base that has traces that carried the signals to the outside world via 16 mounting pins. The chip was then coated with a silicon thermal gel and covered with a distinctive protective metal cap.

1/2" MST packages on 1/8" pin grid
1/2" MST packages on 1/8" pin grid

Top, Bottom, and uncovered view of an MST package
Top, Bottom, and uncovered view of an MST package

Pictured here is a MST chip sitting on top of the MST carrier that contains it.
Pictured here is a MST chip sitting on top of the MST carrier that contains it.

At 10X the chip to pin traces are huge.
At 10X the chip to pin traces are huge.

40x view of the signal traces on the ceramic after the MST chip was removed by force.
40x view of the signal traces on the ceramic after the MST chip was removed by force.

40X view of the bottom or active side of MST chip.
40X view of the bottom or active side of MST chip.

200X view of the bottom or active side of MST chip.
200X view of the bottom or active side of MST chip.

200X view of the bottom or active side of MST chip.
200X view of the bottom or active side of MST chip.

Signals were brought out to the backplane through gold plated pads that mated with the gold plated pins on the backplane.
Signals were brought out to the backplane through gold plated pads that mated with the gold plated pins on the backplane.

10x closeup of the 16 Signal pins on 1/8 spaceing.
10x closeup of the 16 Signal pins on 1/8 spaceing.

These early cards supported up to three signal traces to pass between two adjacent pins on 1/8 inch spaceing on a single layer, on a multilayer board.
These early cards supported up to three signal traces to pass between two adjacent pins on 1/8 inch spaceing on a single layer, on a multilayer board.

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